2024 Investiture Information

Alexander Boys

Assistant Professor of Engineering

Microelectrodes bound onto single stem cell. Professor Boys' laboratory examines new ways to interface cells with electronic systems to create two-way interfaces with the body.


Professor Boys is a materials scientist and biomedical engineer focusing on developing integrative bioelectronic implants for interacting with the body. Prior to joining Dartmouth, Boys earned a PhD in materials science and engineering at Cornell University, where he studied interfacial tissues to develop living implant systems through an NIH F31 fellowship. After this, he moved overseas to the University of Cambridge to work on tissue engineered bioelectronic implants for interfacing with the nervous system through an HFSP cross-disciplinary fellowship.

Research Interests

Bioelectronics; tissue engineering; implant science


  • BS, Materials Science & Engineering, Lehigh University 2013
  • MS, Materials Science & Engineering, Cornell University 2016
  • PhD, Materials Science & Engineering, Cornell University 2019


  • Jesus College, University of Cambridge CPDA 2020
  • HFSP Cross-disciplinary Fellowship 2020
  • NIH F31 Fellowship 2017
  • NSF EAPSI Scholarship 2016
  • Dow Scholarship 2013
  • Bradley Stoughton Student Award 2013

Selected Publications

  • S.R. de Rijk, A.J. Boys, I.V. Roberts, C. Jiang, C. Garcia, R.M. Owens, M. Bance, “Tissue engineered cochlear fibrosis model links complex impedance to fibrosis formation for cochlear implant patients,” Adv Healthcare Mater, 202300732, 2023. DOI: 10.1002/adhm.202300732
  • S. Mack, S.L. Barron, A.J. Boys,* “Digesting digestion: An educational laboratory to teach students about enzymes and the gastrointestinal tract,” J Chem Ed, 100(2): 907–913, 2023. DOI: 10.1021/acs.jchemed.2c00992 *Corresponding author
  • A.J. Boys, A. Carnicer Lombarte, A. Güemes Gonzalez, D.C. van Niekerk, S. Hilton, D.G. Barone, C.M. Proctor, R.M. Owens, G.G. Malliaras, “3D bioelectronics with a remodellable matrix for long-term tissue integration and recording,” Adv Mater, 2207847, 2022. DOI: 10.1002/adma.202207847
  • S.J.K. O'Neill, Z. Huang, M.H. Ahmed, A.J. Boys, S. Velasco-Bosom, J. Li, J.A. McCune, R.M. Owens, G.G. Malliaras, O.A. Scherman, “Tissue-Mimetic Supramolecular Polymer Networks for Bioelectronics,” Adv Mater, 2207634, 2022. DOI: 10.1002/adma.202207634
  • C.Pitsalidis,D.C.vanNiekerk,C.M.Moysidou,A.J.Boys,A.M.Withers,R.Vallet,R.M.Owens,“Organicelectronic transmembrane devices for hosting and monitoring 3D cell cultures,” Sci Adv, 8(37): eabo4761, 2022. DOI: 10.1126/sciadv.abo4761
  • C. Pitsalidis, A.M. Pappa, A.J. Boys, C.M. Moysidou, D.C. van Niekerk, J. Saez, A. Savva, D. Iandolo, R.M. Owens, “In vitro organic bioelectronics,” Chem Rev, 122(4): 4700–4790, 2022. DOI: 10.1021/acs.chemrev.1c00539
  • A.J. Boys, R.M. Owens, “Contractility measurements in tissue engineered constructs and the future of bioelec- tronics in cell mechanics,” APL Mater, 9(4):040903, 2021. DOI: 10.1063/5.0040953
  • A.J. Boys, J.A.M.R. Kunitake, C.R. Henak, I. Cohen, L.A. Estroff, L.J. Bonassar, “Understanding the Stiff-to- Compliant Transition of the Meniscal Attachments through Spatial Correlation of Composition, Structure, and Me- chanics,” ACS Appl Mater Interfaces, 11:26559–26570, 2019. DOI: 10.1021/acsami.9b03595
  • A.J. Boys, H. Zhou, J.B. Harrod, M.C. McCorry, L.A. Estroff, L.J. Bonassar, “Top-down Fabrication of Spatially Controlled Mineral-Gradient Scaffolds for Interfacial Tissue Engineering," ACS Biomater Sci Eng, 5(6):2988–2997, 2019. DOI: 10.1021/acsbiomaterials.9b00176
  • A.J. Boys,* M. Walsh, “Introducing Engineering Design and Materials Science at an Earlier Age through Ceramic Cold Casting,” J Chem Educ, 96(1):104–109, 2019. DOI: 10.1021/acs.jchemed.8b00404 *Corresponding author
  • L.E. Iannucci, A.J. Boys, M.C. McCorry, L.A. Estroff, L.J. Bonassar, “Cellular and Chemical Gradients to Engineer the Meniscus-to-Bone Insertion,” Adv Healthcare Mater, 1800806, 2019. DOI: 10.1002/adhm.201800806
  • A.J. Boys,** M.C. McCorry,** S. Rodeo, L.J. Bonassar, L.A. Estroff, “Next Generation Tissue Engineering of Ortho- pedic Soft Tissue-to-Bone Interfaces,” MRS Comm, 7:289–308, 2017. DOI: 10.1557/mrc.2017.91 **Co-first author