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Jones Seminar: 3D/Heterogeneous Integration—Progress and outlook



3:30pm - 4:30pm ET

Spanos Auditorium, Cummings Hall

Optional ZOOM LINK
Meeting ID: 948 2723 1860
Passcode: 027223

Heterogeneous integration strategies have emerged as a key approach to the development of next generation microsystems, in particular silicon-based computing platforms that combine various processor and memory functionalities in a single package. State-of-the-art architectures are primarily 2.5D structures, combining processor and memory "chiplets" on a multi-layer signal distribution interposer. A broader vision of heterogenous integration, though, involves the integration of diverse technologies such as III-V transistors, non-silicon memory, photonics, MEMS, etc., and leveraging 3D integration strategies to realize highly-integrated "more than Moore" microsystems. This talk will review past efforts in 3D/HI, including DARPA programs, such as the Diverse Accessible Heterogeneous Integration (DAHI) program, and discuss future opportunities to realize high-performance mixed-domain microsystems.

About the Speaker(s)

Sanjay Raman
Professor of Electrical and Computer Engineering, UMass Amherst

Sanjay Raman

Sanjay Raman is the dean of the College of Engineering and a professor of electrical and computer engineering at the University of Massachusetts Amherst. Dean Raman joined UMass from Virginia Tech (VT) where he was associate vice president for the VT National Capital Region, president and CEO of the VT Applied Research Corporation, and a tenured full professor in their Bradley Department of Electrical and Computer Engineering.

Raman earned his Bachelor's degree in electrical engineering from the Georgia Institute of Technology, and his doctorate in electrical engineering from the University of Michigan, Ann Arbor. Prior to his doctoral studies, he served as a nuclear-trained submarine officer in the US Navy. He is a fellow of IEEE, serves on the steering committee of the DARPA Microsystems Exploratory Council, is a member of the Defense Science Board, and is co-General Chair of the 2024 IEEE International Microwave Symposium to be held in Washington, DC.


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