1. Make sure fume exhaust is operational.
  2. Clean the substrate, mask, and spinner bowl

  3. Dry the substrate:

    • 3-5 minutes at 120C on hotplate (or 30 minutes in 120C oven)

    • OPTIONAL: for oxides, pipette on a small amount of HMDS (just enough to cover wafer), puddle 5 seconds, then spin (5s@900RPM, 60S@4000RPM, check vacuum before spinning)

  4. Spin on photoresist:
    • Center sample on spinner and check vacuum.

    • 5 seconds at 900 RPM (this clears excess resist to avoid splash-back)

    • 60 seconds at 4000 RPM (1.3 micron film)

  5. Softbake the resist:

    • 3 minutes on hotplate at 100C (or 30 minutes in the 100 C oven) Note: alternative softbake at 90C will increase resist sensitivity, requiring shorter exposure times.

  6. Align and expose using Karl Suss MJB 3 UV400 mask aligner:

  7. Develop:
    • Puddle MF319 developer for 60 seconds (pattern usually shows in 5 seconds)

    • Spin rinse with DI water 35 seconds at about 300 RPM

    • Spin dry 60 seconds at 3000-4000 RPM, with a burst of nitrogen gas in the center of the sample.

  8. postbake:
    • 3 minutes on hotplate at 120C (or 30 minutes in the 120 C oven)

    S1800 series photoresist DATASHEET

    Photolithography Process Overview