Chia Lun's liftoff

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Subject: Metal left off technique

Adhesion Promoter(HMDS)
-Spread: 8sec, 750 rpm
-spin: 30 sec, 4K rpm
Coating (AZ 5214-E resist; 1.38 micron; Lot D9481)
-Spread: 8 sec 750 rpm
-Spin : 30 Sec 4K rpm
-Prebake: 30 min, 90C
Exposure
-Expose: 1-2 sec
-PEB: 90sec on a 120C hot plate
-Flood expose: 90sec
Developing (AZ 422 MIF developer)
-Develop: 60 sec( to clear)+ 30sec=90sec.
(no color dilution of resist can be seen)
p.s. Octavio said 120 sec also been used with good results)
-Rinse: Di wafer 30 sec
Spin dry

For deposition/etching
--plasma ash: 3 min (remove 240A)
Lift off
-Fill ultrasonic tank w/DI water.
-Set power/degas to 50% of dial.
-Place Acetone in beaker and immerse wafer. Metal lift-off time depends on
thickness/surface tension of metal.
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