A. Basic FED Package

1. Field Emitter Array (FEA) #12

a. D. Temple/H. Gray Group (MCNC and Naval Research Lab)
b. Regular Matrix of Pyramids (4 - 13 um spacing)
c. 232,630 tips on 4-in Si wafer (3E+6 tips/cm^2)
d. Many simultaneous electron beams
e. Jan 1995, maximum of 18 mA for 6648 tip array

2. Illuminating the Phosphors

a. 100's to 1000's of tips behind each phosphor
b. Simultaneous beams illuminate phosphor
c. Even if some tips broken, still works

3. Simple row-column matrix addressing

a. can turn on single element by accessing given row/column
b. no active matrix necessary

B. Typical FED Devices

1. Charles Spindt Prototype (SRI International) #10
a. FEA on 4.9" Si wafer baseplate

b. Address line contacts on sides
c. 338 X 338 pixel array
d. 4 mm thick in total

e. 100 tips per color element (redundancy)
f. 3 elements: R, G, B per pixel
g. 250 um square pixel size

h. 50 - 150 Volt Pixel Driving Range
i. Base: metal strips (175 um wide, 250 um centers)
j. Base: orthogonal gate films (40 um wide, 66 um centers)
k. Clear conducting indium tin oxide (ITO) on screen
l. ITO has RGB strips over gate film strips
m. Pillars: 50 X 50 X 75 um
n. Inner tube evacuated: 10^-9 Torr (turbomolecular pump)

2. Micron Display Technology, Inc.'s Prototype #1
a. Like AMLCD, uses GLASS substrate

b. 0.7 Inch Diagonal Screen Size
c. 700 pixels/inch (Monochrome/Color models)

d. Completely sealed
e. Own built-in driver chips

C. Basic Diamond FED Package

1. Patches of Diamond Films Instead of Pyramids

2. Similar matrix addressing and phosphor screen

D. Typical DFED Device (Si Diamond Technology)

1. 1 square inch monochrone display #5

2. 48 X 48 and 125 X 125 pixel models (50, 125 lines/inch)
3. 350 um wide address lines, pitch size 500 um
4. +/- 200 to 300 Volt driving pixels
5. Soda-lime glass plate substrate
6. Diamond films on chromium lines (rows)
7. ZnO powder phosphors on ITO lines on screen (cols)
8. 25 um high nickel spacers btw base/screen
9. Sealed with Torrseal epoxy
10. Evacuated with activated getter pump
11. Minimum feature size 100 um (1 um for AMLCD)

  • Main Outline
  • IV. Microfabricating FED's
  • Sources