- Difference between the two processes becomes blurred.
- CVD now makes extensive use of plasma
- Reactive evaporation and reactive sputtering occur in a chemical environment.
- CVD and PVD reactors are now combined in one single piece of equipment in new semiconductor processing operation
* Evaporation Facing strong competition from sputtering and CVD
Generally on the decline.
* Sputtering will continue to be the most important PVD process in Silicon VLSI fabrication for some time.
But there are some challenges:
- Uniform films over larger wafers, higher throughput
- The ability to improve step coverage or even planized deposited films , this feature is avidly sought in new sputtering equipment designs
- The machines will need to operate at higher levels of cleaness and more automatically
- Greater reliability (e.g. >90% up time)will be expected
- Techniques to replace (or enhance) sputter etching for in situ cleaning of small area will be developed
- As multilevel interconnected technologies are developed, more multilayer films will be utilized.
- Facing strong competition from sputtering and CVD
Generally on the decline.
* Sputtering will continue to be the most important PVD process in Silicon VLSI fabrication for some time.
But there are some challenges:
- Uniform films over larger wafers, higher throughput
- The ability to improve step coverage or even planized deposited films , this feature is avidly sought in new sputtering equipment designs
- The machines will need to operate at higher levels of cleaness and more automatically
- Greater reliability (e.g. >90% up time)will be expected
- Techniques to replace (or enhance) sputter etching for in situ cleaning of small area will be developed
- As multilevel interconnected technologies are developed, more multilayer films will be utilized.
- will continue to be the most important PVD process in Silicon VLSI fabrication for some time.
- Uniform films over larger wafers, higher throughput
- The ability to improve step coverage or even planized deposited films , this feature is avidly sought in new sputtering equipment designs
- The machines will need to operate at higher levels of cleaness and more automatically
- Greater reliability (e.g. >90% up time)will be expected
- Techniques to replace (or enhance) sputter etching for in situ cleaning of small area will be developed
- As multilevel interconnected technologies are developed, more multilayer films will be utilized.
But there are some challenges: