Dear =
Christopher,

As a user of SU8, I want =
to inform you in more details concerning Sotec =
microsystems.

It makes now more then 3 =
years that SOTEC MICROSYSTEMS working with SU8 =
photoepoxy

for realize a =
prototypes devices (this material has partly been developed =
in

 our lab at the Swiss =
Federal Institute of Technology in Lausanne in =
1996)

 and this year we =
implanted the new technology for saving your time and =
money

 by using The ANSYS =
simulations systems for testing clients prototype by =

simulating the  fatige and the  reability of SU8 Epon =
Structure.

We are now giving service =
to analyze your New structure with our New list and prices of =

SU8 product with ANSYS =
simulation systems.

We have the =
following new photoepoxy =
variations:

SU8

SOTEC MICROSYSTEMS=20 SA commercializes SU8 = photoepoxies.=20 The following formulations are available:

SM1040

For layers between 1 and 10 =B5m

SM1060

For layers between 10 and 50 =B5m

SM1070

For layers between 50 and 500 =B5m

Other=20 formulations are available if requested.

SOTEC MICROSYSTEMS=20 SA offers the following low-stress = SU8=20 photoepoxies:

SM1040-50

Standard SM1040=20 with 50% of SiO₂, CTE : 30 ppm/K

SM1040-70

Standard SM1040=20 with 70% of SiO₂, CTE : 21 ppm/K

SM1060-50

Standard SM1060=20 with 50% of SiO₂, CTE : 30 ppm/K

SM1060-70

Standard SM1060=20 with 70% of SiO₂, CTE : 21 ppm/K

SM1070-50

Standard SM1070=20 with 50% of SiO₂, CTE : 30 ppm/K

SM1070-70

Standard SM1070=20 with 70% of SiO₂, CTE : 21 ppm/K

Other formulations are available on = request.=20

SOTEC MICROSYSTEMS=20 SA offers the following = developer for=20 SU8 photoepoxies :

SMPA

SU-8 developer

SOTEC MICROSYSTEMS=20 SA offers the following = adhesion=20 promoter for SU8 photoepoxies :

SMAD

SU-8 adhesion promoter

SOTEC MICROSYSTEMS=20 SA offers the following stripper = for SU8=20 photoepoxies :

SMST-S

This formulation has to been used if copper = is present=20 on the SU8 structure. All other metal with exception of nickel are = not=20 attacked. ATTENTION: the etch-rate is much slower (~100% slower) ! = !

SMST-M

This formulation is the standard formulation. = It=20 doesn't attact metals such as aluminum, gold, titanium, chromium, = but a=20 slight attack of copper and nickel can be observed.

SMST-H

This formulation has to been used if nickel = is present=20 on the SU8 structure. The etch-rate is similar to the SMST-M. This = formulation can also be used for the desencapsulation of = integrated=20 circuits.

The = following=20 prices are given:

SM10x0 0.5l (minimum quantity)

400 USD

SM10x0 1l

720 USD

SM10x0-y0 0.5l (minimum quantity)

500 USD

SM10x0-y0 1l

900 USD

SMPA 1l (minimum quantity)

200 USD

SMAD 100ml (minimum quantity)

200 USD

SMAD 500ml

900 USD

SMST-S/M/D 1l

1000 USD

Polymerized epoxy wafers for the thermal stress reduction of = photoepoxy=20 structures
the wafers are available in the following thicknesses: 1 = mm.=20

3 inch wafer

20 USD

4 inch wafer

40 USD

Should you have any more =
questions, please contact me.

Dr. Judelewicz =
Moshe

****************************************************

Dr. Judelewicz Moshe

Business Development&Marketing Director

SOTEC Microsystem

11 avenue des Baumettes

CH-1020 Renens SWITZERLAND

http://www.somisys.ch

E-mail: judelewi@hotmail.com

Office: +41216359532/30

Natel+41765392167 Switzerland

Natel +97254939169 Israel

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