From cgl@nimbus.dartmouth.edu Wed Jan 16 11:58:55 2002 Return-Path: Received: from nimbus.dartmouth.edu (nimbus.dartmouth.edu [129.170.16.33]) by thayer.dartmouth.edu (8.11.6/8.11.6) with ESMTP id g0GGwt617062 for ; Wed, 16 Jan 2002 11:58:55 -0500 Received: (from cgl@localhost) by nimbus.dartmouth.edu (8.9.3/8.9.3) id LAA21674 for microeng@thayer.dartmouth.edu; Wed, 16 Jan 2002 11:58:54 -0500 Received: from kronos.mems-exchange.org (kronos.mems-exchange.org [132.151.8.1]) by nimbus.dartmouth.edu (8.9.3/8.9.3) with ESMTP id JAA18352 for ; Tue, 15 Jan 2002 09:54:51 -0500 Received: from localhost ([127.0.0.1] helo=kronos.mems-exchange.org) by kronos.mems-exchange.org with esmtp (Exim 3.12 #1) id 16QUyi-0007tB-00; Tue, 15 Jan 2002 09:54:20 -0500 Received: from [63.161.97.104] (helo=magellan.evgroup.com) by kronos.mems-exchange.org with smtp (Exim 3.12 #1) id 16QE7J-0003Ft-00 for mems-talk@memsnet.org; Mon, 14 Jan 2002 15:54:05 -0500 Received: by MAGELLAN with Internet Mail Service (5.5.2653.19) id <4F7LF6MG>; Mon, 14 Jan 2002 13:53:58 -0700 Message-ID: <1DD2B880949BD311907B0050040C0A2437131E@MAGELLAN> From: Brubaker Chad To: mems-talk@memsnet.org Subject: RE: [mems-talk] adhesives MIME-Version: 1.0 X-Mailer: Internet Mail Service (5.5.2653.19) Content-Type: text/plain; charset="us-ascii" X-Converted-To-Plain-Text: from multipart/mixed by demime 0.98e X-Converted-To-Plain-Text: Alternative section used was text/plain Sender: mems-talk-admin@memsnet.org Errors-To: mems-talk-admin@memsnet.org X-BeenThere: mems-talk@memsnet.org X-Mailman-Version: 2.0.5 Precedence: bulk Reply-To: mems-talk@memsnet.org List-Help: List-Post: List-Subscribe: , List-Id: General MEMS discussion List-Unsubscribe: , List-Archive: Date: Mon, 14 Jan 2002 13:53:57 -0700 X-Status: X-Keywords: X-UID: 4 Status: RO There are actually a wide variety of materials that could be used for this process, depending on the process you wish to use to apply the material. Off of the top of my head, I can think of three basic types: 1. Thermoplastic film: This would be a film that would be applied through application of heat and pressure. Various materials are WaferGrip (wax, heat release - Dynatex), StayStik (general adhesive, high temp, solvent release - Cookson), Ablestik (general adhesive, low temp, solvent release). 2. Thermoplastic spin on material: This is a material that would be spun on using a resist coater (in some cases, requiring modification). Various materials: photoresist, GenTak (general adhesive, various grades, solvent release - General Chemical), Staystick - paste form (see above) 3. Dry Film Materials - This would be a film that is applied via a tape roll (either manually, or by a taping machine). Only one comes to mind at the moment: Revalpha (Nitto Denko). This is effectively a tape with adhesive material on both sides. However, this is a thermal release film, meaning that, when a certain threshold temperature is reached (depending on grade), one side of the adhesive will undergo a chemical reaction that will cause the material to become gaseous, allowing a total release of the substrate. This may be the best case for thin substrates, as there will be little to no "peeling" force required to remove the substrate. Best Regards, Chad Brubaker <<...OLE_Obj...>> EV Group-Technology, Tel: (602) 437 9492 x 111, Fax: (602) 437 9435 E-mail: C.Brubaker@evgroup.com , Web: www.EVGroup.com, 01/14/02 <> -----Original Message----- From: kaustubh bhate [mailto:kaustubhbhate@yahoo.com] Sent: Friday, December 21, 2001 10:24 AM To: mems-talk@memsnet.org Subject: [mems-talk] adhesives Hi Everybody, I am trying to bond some pre-thinned wafers (200um thick) with LPCVD nitride on it (1000A) - to a normal wafer substrate(500um ) thick.I need a temporary bonding adhesive which I should be able to remove after I have done some etching/lithography steps on the pre-thinned wafers. Does anybody know of commercially available adhesives that I can use for this? I need an adhesive which is very simple in it's application and ideally would like something which I can just apply in-between the two wafers and then stick them together and later should be able to de-bond them easily too. Kaustubh Bhate. ===== Check out Yahoo! Shopping and Yahoo! Auctions for all of your unique holiday gifts! Buy at http://shopping.yahoo.com or bid at http://auctions.yahoo.com _______________________________________________ mems-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.mems-exchange.org/ [demime 0.98e removed an attachment of type application/octet-stream which had a name of Chad W Brubaker (E-mail).vcf] _______________________________________________ mems-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.mems-exchange.org/