1The acronym `PFR' was developed at MIT's Microsystems Technology Lab. A different nomenclature is used at the U. of California at Berkeley. There is a thrust, nationwide, to develop a common approach to the representation of process information.

2W. Kern, ed., "Handbook of Semiconductor Wafer Cleaning Technology". Noyes Publications, Park Ridge, NJ (1993)

3This step may require two parts: a first step in the furnace, in an N2 ambient, to pre-deposit the boron; followed by a second step, without the BN disks in the furnace, in either an N2 or O2 ambient, to drive in the boron.