Magnetron Sputtering

Increase the percentage of electrons that cause ionizing collisions by utilizing a magnetic fields to help to confine electrons near the target.

• Deposition pressure : 10^-3 to 0.1 Pa ( 10^-5 to 10^-3 torr)
• Deposition rate : 0.2 to 2 E-6 m/min
• Depostion temperature : 100 to 150 C

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Comments:

• Very high deposition rates, low deposition pressure, low substrate temperature, can be scaled up, so commonly used for industrial production
• More complex than planar diode systems

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