means the energetic particles used to strike target is generated by glow-discharge.
Creation of glow-discharge
- Tube filled with argon, neutral, no charged particales between cathode and anode
- Elastic collision, no energy exchange
- Inelastic collision
- Energy not enough high, excite electrons, emitting photons
- Energy high enough, ionize electrons, cause secondary free electrons
- Both free electrons are accelerated again, so cause cascading or gas break down
- Flow of electrons is collected by anode, current will quickly decay to zero
Self-sustained mechanism
Secondary electrons provide a source to sustain glow-discharge
- Positive ion comes close to surface of target, as a potential well
- Some of target electrons can tunnel into the ion, and escape from the target
- Extra energy is released in the form of photon
- The secondary electron yield per bombardment ion is about 0.1 for metal targets, but considerable higher for dielectric targets
Parameters
- Type of coating materials: essentially any e.g. Au, Ag, W, Al2O3. SiO2, Tic, ZrO2, Cr2O3, Poly
- Kinetic energy: 10 to 100eV
- Deposition pressure : 0.5 to 10 Pa or 5E-3 to 0.1 torr
- Deposition temperature : 100 to 300 C
- Coating thickness range : 0.02 to 10 E-6 m
- Deposition rate : 0.02 to 2 E-6 m/min
- Relative adhesion : generally good
Advantages:
- Simple, wide choice of coating materials
- Easy to obtain stoichiometric alloys and compounds coatings, better than evaporation.
- Low substrate temperature
- Excellent uniformity over complex and large areas
Disadvantages:
- Relatively low kinetic energy
- Deep recesses are usually about 1nm
Some Kind of Glow-Discharge Sputtering
Traping of impurities during the sputtering
- Bias sputtering
- Getter Sputtering
Sputtering of multicomponent/compound coatings
- Sputtering of multicomponent materials
- Reactive sputtering
- Tube filled with argon, neutral, no charged particales between cathode and anode
- Elastic collision, no energy exchange
- Inelastic collision
- Energy not enough high, excite electrons, emitting photons
- Energy high enough, ionize electrons, cause secondary free electrons
- Both free electrons are accelerated again, so cause cascading or gas break down
- Flow of electrons is collected by anode, current will quickly decay to zero
Self-sustained mechanism
Secondary electrons provide a source to sustain glow-discharge
- Positive ion comes close to surface of target, as a potential well
- Some of target electrons can tunnel into the ion, and escape from the target
- Extra energy is released in the form of photon
- The secondary electron yield per bombardment ion is about 0.1 for metal targets, but considerable higher for dielectric targets
Parameters
- Type of coating materials: essentially any e.g. Au, Ag, W, Al2O3. SiO2, Tic, ZrO2, Cr2O3, Poly
- Kinetic energy: 10 to 100eV
- Deposition pressure : 0.5 to 10 Pa or 5E-3 to 0.1 torr
- Deposition temperature : 100 to 300 C
- Coating thickness range : 0.02 to 10 E-6 m
- Deposition rate : 0.02 to 2 E-6 m/min
- Relative adhesion : generally good
Advantages:
- Simple, wide choice of coating materials
- Easy to obtain stoichiometric alloys and compounds coatings, better than evaporation.
- Low substrate temperature
- Excellent uniformity over complex and large areas
Disadvantages:
- Relatively low kinetic energy
- Deep recesses are usually about 1nm
Some Kind of Glow-Discharge Sputtering
Traping of impurities during the sputtering
- Bias sputtering
- Getter Sputtering
Sputtering of multicomponent/compound coatings
- Sputtering of multicomponent materials
- Reactive sputtering
- Energy not enough high, excite electrons, emitting photons
- Energy high enough, ionize electrons, cause secondary free electrons
- Both free electrons are accelerated again, so cause cascading or gas break down
- Flow of electrons is collected by anode, current will quickly decay to zero